XBee S2C 802.15.4模块
更新日期：2017-11-28 10:05:22 浏览次数：1602次 所属分类：XBee/无线射频模块
Digi XBee S2C 802.15.4 Digi XBee-PRO S2C 802.15.4 PERFORMANCE TRANSCEIVER CHIPSET Silicon Labs EM357 SoC DA
| Digi XBee S2C 802.15.4 | Digi XBee-PRO S2C 802.15.4 | |
|---|---|---|
| PERFORMANCE | ||
| TRANSCEIVER CHIPSET | Silicon Labs EM357 SoC | |
| DATA RATE | RF 250 Kbps, Serial up to 1 Mbps | |
| INDOOR/URBAN RANGE | 200 ft (60 m) | 300 ft (90 m) |
| OUTDOOR/RF LINE-OF-SIGHT RANGE | 4000 ft (1200 m) | 2 miles (3200 m) |
| TRANSMIT POWER | 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)boost mode | 63 mW (+18 dBm) |
| RECEIVER SENSITIVITY (1% PER) | -100 dBm / -102 dBm boost mode | -101 dBm |
| FEATURES | ||
| SERIAL DATA INTERFACE | UART, SPI | |
| CONFIGURATION METHOD | API or AT commands, local or over-the-air (OTA) | |
| FREQUENCY BAND | ISM 2.4 GHz | |
| FORM FACTOR | Through-Hole, Surface Mount | |
| HARDWARE | S2C | |
| ADC INPUTS | (4) 10-bit ADC inputs | |
| DIGITAL I/O | 15 | |
| ANTENNA OPTIONS |
Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire SMT: RF Pad, PCB Antenna, or U.FL Connector |
|
| OPERATING TEMPERATURE | -40o C to +85o C | |
| DIMENSIONS (L X W X H) AND WEIGHT |
Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) |
Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) |
| NETWORKING AND SECURITY | ||
| PROTOCOL | XBee 802.15.4 (Proprietary 802.15.4) | |
| UPDATABLE TO DIGIMESH PROTOCOL | Yes | |
| UPDATABLE TO ZIGBEE PROTOCOL | Yes | |
| INTERFERENCE IMMUNITY | DSSS (Direct Sequence Spread Spectrum) | |
| ENCRYPTION | 128-bit AES | |
| RELIABLE PACKET DELIVERY | Retries/Acknowledgements | |
| FILTRATION OPTIONS | PAN ID, Channel, and 64-bit addresses | |
| CHANNELS | 16 channels | 15 channels |
| POWER REQUIREMENTS | ||
| SUPPLY VOLTAGE | 2.1 to 3.6V | 2.7 to 3.6V |
| TRANSMIT CURRENT | 33 mA @ 3.3 VDC / 45 mA boost mode | 120 mA @ 3.3 VDC |
| RECEIVE CURRENT | 28 mA @ 3.3 VDC / 31 mA boost mode | 31 mA @ 3.3 VDC |
| POWER-DOWN CURRENT | <1 μA @ 25o C | <1 μA @ 25o C |
| REGULATORY APPROVALS | ||
| FCC, IC (NORTH AMERICA) | Yes | Yes |
| ETSI (EUROPE) | Yes | No |
| RCM (AUSTRALIA AND NEW ZEALAND) | No (Coming soon) | No (Coming soon) |
| TELEC (JAPAN) | No (Coming soon) | No (Coming soon) |
